Eliyan Blog the company blog of Eliyan: latest posts and feed

Oct 13

Eliyan Introduces NuLight™: World’s First 2D microVCSEL Interconnect Solution to the Copper Wall

Nexus™ and Oscar™ chiplets deliver high-bandwidth, long-reach optical connectivity with copper-like reliability and supply availability, supporting modular configurations from 1.6 Tbps OSFP to 12.8 Tbps XPO.

Aug 13

Eliyan Featured on The Information’s TITV

Thanks to the team at The Information for having us on the TITV show to discuss our recent fundraising, led by Seligman Ventures, and including new strategic investors Cisco Venture Labs and Lumentum, which puts us at status.

Jul 30

The AI race built faster chips. Now the chips are too fast for their own wires

Jul 29

Eliyan Achieves Unicorn Status with $145 Million Series C to Advance Electro-optical Interconnects for AI Infrastructure

Eliyan’s latest funding round, led by Seligman Ventures, values the company at $1 billion and includes new strategic investors Cisco Investments and Lumentum. Santa Clara, Calif.

Jul 29

Eliyan raises $145 million at $1 billion valuation to ease AI chip data bottlenecks

Jul 29

Optical interconnect startup Eliyan raises $145M in funding to solve the AI chip cluster connectivity crunch

Jul 29

Eliyan Achieves Unicorn Status with $145 Million Series C to Advance Electro-optical Interconnects for AI Infrastructure

Jul 24

Eliyan Introduces NuLink™-XD, a New Class of Power-Reach Configurable 224G PAM4 SerDes Enabling the Industry’s Lowest-Power Electro-Optical Modules for AI Scale-Up

Purpose-built for AI Interconnects in Chip-to-Chip and Chip-To-Module applications, Eliyan’s NuLink™-XD 224G SerDes Enables Next-Generation Implementations such as Near-Package Optics, OSFP and XPO Highlights: SANTA CLARA, California –...

Feb 18

HBM4 and SPHBM4: Scaling Memory Bandwidth for AI and HPC

Feb 2

Eliyan Raises $50M From AMD, Arm, Meta to Tackle AI’s Interconnect Bottleneck

Jan 28

Eliyan Secures $50 Million in Strategic Investments